锡膏印刷机知识-锡膏厚度控制规格

日期：2025-04-25 19:54

浏览次数：3318

摘要：

Solder Paste height control Spec锡膏厚度控制规格

1.Purpose 目的：

This document is in order to control prodution line's solder paste height limit

此文件是为了规范生产线锡膏厚度的控制限度。

2.Scope 范围：

Application wuxi factroy 适用于无锡工厂

3.Reference file参考文件：

According to the solder paste height VA of each workcell

参考每个项目组锡膏厚度的VA

4.Instruction说明：

Generally: Stencil thickness + 1.0 mil then +/-1.5mil

For example: stencil thickness=5mil ;solder paste height=(5+1)+/-1.5mil;solder paste height is 4.5~7.5mil

Note:According to the requirement when customer has a special request and write it down in correlative file DOCUMENT NO.

通常：锡膏厚度为钢网厚度+1.0 mil再+/-1.5mil

例如：钢网厚度=5mil;锡膏厚度=（5+1）+/-1.5mil;即锡膏厚度为4.5~7.5mil SHEET 1 OF 1

备注：如果客户有特殊要求，按照客户的要求执行并且在相关文件上注明。